| Availability: | |
|---|---|
| Name | Chip Capacitor |
| Type | Double-Sided Edge-Retained Type |
| Model | 91MCC101A |
| Capacitance | 100pF±20%@1kHz,1Vrms,25°C,No DC Bias |
| Withstand Voltage | 100V |
| Operating Temperature | -55℃ ~ +125℃ |
| Coating - Upper Layer | TaN/TiW/Ni/Au 2.5µm Min |
| Coating - Lower Layer | TaN/TiW/Ni/Au 2.5µm Min |
Overall Dimensions

Remarks:
1. Storage Conditions: 20-25℃, 40%-60% humidity;
2. Shelf Life: 1 year after delivery under storage conditions;
3. Suitable for bonding process with conductive adhesive H20E, baking at 120℃ for 30 minutes;
4. The welding position of the welding wire should be 25µm or more from the edge of the electrode to avoid electrode falling off.
| Name | Chip Capacitor |
| Type | Double-Sided Edge-Retained Type |
| Model | 91MCC101A |
| Capacitance | 100pF±20%@1kHz,1Vrms,25°C,No DC Bias |
| Withstand Voltage | 100V |
| Operating Temperature | -55℃ ~ +125℃ |
| Coating - Upper Layer | TaN/TiW/Ni/Au 2.5µm Min |
| Coating - Lower Layer | TaN/TiW/Ni/Au 2.5µm Min |
Overall Dimensions

Remarks:
1. Storage Conditions: 20-25℃, 40%-60% humidity;
2. Shelf Life: 1 year after delivery under storage conditions;
3. Suitable for bonding process with conductive adhesive H20E, baking at 120℃ for 30 minutes;
4. The welding position of the welding wire should be 25µm or more from the edge of the electrode to avoid electrode falling off.