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Chip Capacitor 91MCC331G Single-sided Edge Reserved Type 330pF High Temperature Resistant High Precision SMD Capacitor

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The 91MCC331G is a single-sided edge reserved chip capacitor with a capacitance of 330pF±20% (test conditions: 1kHz, 1Vrms, 25°C, No DC Bias) and a withstand voltage of 16V. Its operating temperature range is from -55℃ to +125℃, suitable for various high and low temperature industrial scenarios. The upper plating of the product is TiW-Au (4.0µm Min), and the bottom plating is TiW-Pt-Au (0.5µm Min), with thick plating and excellent conductivity. It is suitable for the bonding process with conductive adhesive H20E, which can be completed by baking at 120℃ for 30 minutes. To prevent electrode falling off, the welding wire should be 25µm or more away from the electrode edge during welding. When stored at 20-25℃ with 40%-60% humidity, the shelf life is 1 year after delivery.
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This 91MCC331G chip capacitor features a single-sided edge reserved design with stable core electrical performance parameters. The capacitance tolerance of 330pF is precisely controlled within ±20%, and the 16V withstand voltage meets the usage requirements of conventional circuits. Its wide temperature operating characteristic enables it to work normally in harsh temperature environments from -55℃ to +125℃. The plating adopts high-spec precious metal materials, and the combination of different platings on the upper and lower layers balances conductivity and adhesion. It is suitable for professional bonding processes with easy operation. The product has clear storage and usage specifications, and strict compliance with the specifications can effectively ensure the service life and use effect of the product, making it a high-quality capacitor accessory for precision electronic circuits and chip-related applications.

Name Chip Capacitor
Model 91MCC331G
Type Single-sided Edge Reserved Type
Capacitance 330pF±20%@1kHz,1Vrms,25°C,No DC Bias
Withstand Voltage 16V
Operating Temperature -55℃ ~ +125℃
Plating - Upper Layer TiW-Au 4.0µm Min
Plating - Bottom Layer TiW-Pt-Au 0.5µm Min

Overall Dimensions

97b89d6a35cb1bd535b64e719e3ea4ad


Remarks:

  1. Storage Conditions: 20-25℃, 40%-60% humidity;

  2. Shelf Life: 1 year after delivery under storage conditions;

  3. Suitable for bonding process, conductive adhesive H20E, baking at 120℃ for 30 minutes;

  4. The welding position of the welding wire should be 25µm or more away from the electrode edge to avoid electrode falling off.


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